In 1994, the program began "Improved Design Life and Environmentally Aware Manufacturing of Electronics Assemblies by Lead-free Soldering" (Ideals). Research groups, OEMs and associations met to discuss and consider more than 200 lead-free alloys. It turned out that only served less than 10 of all options tested. Finally they concluded that, for most processes, the alloy best suited was this made by tin / silver / copper also called SAC. The melting temperature of the alloy SAC305 (96.5% Sn, 3.0% Ag, 0.5% Cu) is 34 º C higher than SnPb.
It is in the Japanese market where the most influential environmental pressure, because the climatic consequences have become more clearly visible in this country than in other parts of the world. In 1998, the Japanese emphasized three alternatives: a form of SnAgCu and two forms of SnAgBi. The Japanese movement is one that has been gradually pushing the rest of the world to start the conversion to lead-free production. The Japanese government was not sure of regulating the use of lead in consumer electronics products because of the potential economic impact, but many of its efforts to reduce lead has been followed voluntarily by the industry. Many Japanese OEMs made numerous announcements about its goal to reduce and eliminate lead from their products and even have shown that so-called green products can increase market share. One example is the MJ30 MiniDisc launched by Matsushita (Panasonic) in 1998 and the first product sold as Lead Free. The slogan said "Because Even the Smallest details help the planet" (as even the smallest details help the planet). Specifically SnAgBi used a welding. Its market share increased from 4.6% to 15% in just six months.
In Europe, the RoHS Directive was published on February 13, 2003 and last revised on 13 February 2005. Entered into force on July 1, 2006. Restricts six substances, including lead.
Some believe that the completion of the implementation of the RoHS Directive will be the most damaging event in the history of the electronics industry. However, well used, can be a marketing tool.
Oxyacetylene welding.
Oxyacetylene welding is the most widespread form of welding. In this type of welding is not necessary input material. This type of welding can be done with material for production of the same nature as the base material (homogenous welding) or different material (heterogeneous) and also without filler material (welding). If they are to join two metal sheets are placed next to each other. It is necessary to heat rapidly to the melting point only of the union and fusion of the two materials produces a seam.
To achieve a rapid merger (and prevent heat from spreading) is used a torch that combines oxygen (as oxidizer) and acetylene (fuel). The mixture produces a peak with a central hole that leaves acetylene, surrounded by four or more holes through which oxygen leaves (and venturi generates suction effect in acetylene). Both gases are combined in a cave before going to the peak, where there is a pale blue flame, very thin. The flame reaches a temperature of 3050 º C.